Dynatron 88885175 Fiche technique

Naviguer en ligne ou télécharger Fiche technique pour Composants de refroidissement des ordinateurs Dynatron 88885175. Dynatron K2 Manuel d'utilisatio

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NEW PRODUCT SPEC SHEET
Model Number: K2
Recommend for Intel® Xeon® Processor E3 Family, Socket LGA1155
2
nd
Generation Core™ i3 / i5 / i7 Desktop Processors, Socket LGA1155
Previous
Generation Core™ i3 / i5 / i7 Desktop Processors, Socket LGA1156
Active Cooler for Mini-ITX Form Factory and Quiet Solution
Overall Specification:
Dimension: 82.6 x 81.0 x 27.8mm
Weight: 380g ± 5g
Material: Copper Heat Sink with Skiving Fins
Alloy Frame Blower with PWM function
Plastic Push-Pin Mounting for avoiding interference with back end components
GE-Toshiba TIG830SP Thermal Grease Pre-Printed
Support CPU Power up to 73 Watts
Blower Specification:
Model Number: DB127515BM-PWMG
Dimension: Ø75.0 x 15.0 mm
Bearing: Double-Ball
Rated Voltage: 12V
Rated Speed:
o At Duty Cycle 0~20%: 1000±10% RPM
o At Duty Cycle 50%: 2500±10% RPM
o At Duty Cycle 100%: 4000 RPM Max
Rated Input Power:
o At Duty Cycle 0~20%: 0.60 W
o At Duty Cycle 50%: 1.80 W
o At Duty Cycle 100%: 4.80 W
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Résumé du contenu

Page 1 - Model Number: K2

NEW PRODUCT SPEC SHEET Model Number: K2 • Recommend for Intel® Xeon® Processor E3 Family, Socket LGA1155 2nd Generatio

Page 2 - Thermal Target

2787572.369.5687072747678800 2000 2500 3000 3800 4000Blower Speed (RPM)CPU temperature ( °c )2126313641Noise Level (dBA)TcNoise • Rated Airflow:

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